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Abstract: In the rapidly evolving domain of distributed networks, including cloud computing and edge systems, achieving optimal performance efficiency is critical. Existing methods often fail to ...
Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
G’s space-ground integrated networks need reliable simulation tools for LEO satellite mega-constellations. A new study in ...