New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.
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SINGAPORE, March 2, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact ...
Kontron Electronics has expanded its embedded product range with the launch of the OSM‑S AM62L, a compact system‑on‑module built to the Open Standard Module (OSM) specification. The new module ...
Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE: TDY), today announced the launch of the Lepton ® XDS, a compact dual‑thermal‑and‑visible camera module bringing Teledyne FLIR’s ...
The Lepton XDS pairs a 160 × 120 radiometric Lepton 3.5 micro‑thermal camera with a five‑megapixel (MP) visible sensor, featuring MSX that enhances thermal imagery in real time by embossing ...
SAN JOSE, Calif., Feb. 24, 2026 (GLOBE NEWSWIRE) -- Cavli Wireless, a pioneering end-to-end IoT solutions provider specializing in cellular IoT hardware, connectivity, and software, continues to ...
Enabling higher power delivery within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device and can be stacked to 200 A. The module integrates a 16-V IN buck converter ...
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