Abstract: Advanced integrated circuit (IC) systems increasingly utilize chiplet-based packaging with complex $2.5 \mathrm{D} / 3 \mathrm{D}$ structures and dense Through-Silicon Via (TSV) arrays.
Abstract: This paper proposes a two-dimensional finite element analysis (2-D FEA) model for axial flux permanent magnet motors (AFPMMs) that addresses the computational burden of three-dimensional ...
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