For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet increasingly complex, set of challenges: how do we manage power, dissipate ...
Abstract: This article presents an accuracy-preserving unified multiphysics domain decomposition framework for electromagneto-thermo-mechanical analysis, which is based on the dual–primal ...
Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...
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