Abstract: The increasing demand for high-speed optical interconnects requires the integration of photonics and electronics, with electro-optic (EO) co-simulation being crucial. However, fragmented ...
Abstract: Monolithic inter-tier vias (MIVs) in monolithic 3-D integrated circuits (M3D ICs) enables massive vertical integration. However, MIVs are more susceptible to defects due to high integration ...
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