Abstract: To address the issue of significantly enhanced electromigration effects in copper interconnects of integrated circuits, this study establishes an electro-thermal coupling simulation model ...
New research from a team at Trinity College Dublin has unearthed a cheap and environmentally friendly new option for removing pollutants from our water. The key? Oyster shells that would ordinarily ...
Abstract: 3D NAND technology is essential to the growing demands in data storage. Wafer warpage, contributed by multiscale interfacial stress within the device during fabrication, limits lithography ...
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