For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...
Multiphysics challenges in 3D ICs involve managing the combined impacts of electrical, thermal, and mechanical phenomena, ...
As finite element models grow in size and complexity, solver performance becomes increasingly important. The COMSOL Multiphysics® software offers a comprehensive selection of solvers that enable users ...
Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...
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Abstract: As the integrated chip packaging technology progresses from 2.5-D to 3-D, new issues arise regarding the reliability of interconnects. The analysis of interconnect reliability is inherently ...
Credit: Gorodenkoff/Shutterstock Enhances system-level engineering with expanded digital twin capabilities and connected modeling workflows that deliver deeper real ...
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