Proven interface IP architectures realized significant gains in performance and power efficiency on the TSMC N3E process 224G-LR SerDes PHY IP on the TSMC N3E process has achieved first-pass silicon ...
The boundaries between IP reuse, interconnect design, and hardware-software integration are no longer independent.
Forbes contributors publish independent expert analyses and insights. I write about disruptive companies, technologies and usage models. Over the years, the cost of designing a system on chip (SoC) ...
RFICs (Radio Frequency Integrated Circuits) for wireless data transmission systems, such as transceivers and RF front-end components, are becoming more complex based on the demands of our connected ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today unveiled its 112G Extended Long-Reach (112G-ELR) SerDes IP on TSMC’s N4P process for hyperscale ASICs, artificial ...
Semiconductor intellectual property (IP) management, reuse, and change tracking are essential for efficiently creating chip designs based on proven building blocks, reducing your time-to-market, and ...
Employing network-on-chip (NoC) technology in system-on-chip (SoC) designs has been proven to reduce routing congestion and lower power consumption. Now, a new NoC-enabled tiling methodology helps ...
Vehicles can do much more than they were capable of a decade ago. Today’s modern connected vehicles have many convenient capabilities, from lane departure warnings to automated braking and ...
SANTA CLARA, Calif. & CAMBRIDGE, England--(BUSINESS WIRE)--Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute ...